Tuesday, 10 November 2020 11:17

cypress CYW920819EVB-02 Evaluation Kit Featured

The Cypress CYW920819EVB-02 Evaluation Kit enables you to evaluate and develop single-chip Bluetooth applications using the CYW20819, an ultra-low-power dual-mode Bluetooth 5.0 wireless MCU device.

  • 62-ball CYW20819 Bluetooth 5.2-compliant Bluetooth/BLE wireless MCU
  • Arduino compatible headers for hardware expansion
  • On-board sensors - a 9-axis motion sensor (3D digital linear acceleration sensor, 3D digital angular rate sensor, and 3D digital magnetic sensor) and a thermistor

Price: $49.00

The Cypress CYW920819EVB-02 Evaluation Kit enables you to evaluate and develop single-chip Bluetooth applications using the CYW20819, an ultra-low-power dual-mode Bluetooth 5.0 wireless MCU device. The CYW20819 is a stand-alone baseband processor with an integrated 2.4 GHz transceiver supporting BR/EDR/BLE. Manufactured using advanced CMOS low-power process, the CYW20819 employs the high of integration to reduce external components, thereby minimizing the device's footprint and cost. This kit helps evaluate device functionality and develop applications quickly for faster time-to-market. CYW20819 supported Bluetooth SIG-certified mesh v1.0. CYW20819EVB-02 can also be used to mesh functionality on CYW20819 device using ModusToolbox.

Cypress also offers a purpose-built Bluetooth mesh kit that comes with four boards and several on-board sensors to implement more complete mesh application without any external hardware.   

The CYW20819 device and the CYW920819EVB-02 evaluation kit are supported in ModusToolbox IDE 1.1 (or later).

Kit Features:

  • 62-ball CYW20819 Bluetooth 5.0-compliant Bluetooth/BLE wireless MCU
  • Arduino compatible headers for hardware expansion
  • On-board sensors - a 9-axis motion sensor (3D digital linear acceleration sensor, 3D digital angular rate sensor, and 3D digital magnetic sensor) and a thermistor
  • User switch and LEDs
  • USB connector for power, programming and USB-UART bridge
Read 12159 times Last modified on Tuesday, 10 November 2020 11:31