便宜发
金融理财
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- The company’s Wi-Fi and Wi-Fi/Bluetooth combo solutions are pre-integrated across its i.MX RT MCU platform, allowing developers to create the optimal pairing of processing with connectivity
- NXP combines its MCU and Wi-Fi/Bluetooth platform solutions within its MCUXpresso Software Development Kit (SDK) to simplify and accelerate IoT product development
- Connectivity modules and MCU development kits are available now through NXP’s extensive distribution network
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Market Research
- Company introduces new 2x2 Wi-Fi 6 Dual Band + Bluetooth / Bluetooth Low Energy (BLE) solution that brings 1.2 Gbps performance, low power, and greater range to IoT markets.
- Family of products deliver new levels of connectivity and power the world’s first Wi-Fi 6 enabled gaming consoles
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News and reports
RSL10 SIP 是将业界最低功耗的蓝牙低功耗技术用于无线应用的最简便方案。
RSL10 SIP 通过了蓝牙 5 认证，完全符合全球无线标准，采用了无需任何额外天线的设计，可显著缩短产品上市时间。
即用型 RSL10 SIP 将集成式天线、RSL10 无线电 SoC 和所有无源组件整合在一个微型封装内。
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Bluetooth chips
Professional market research service
Published in
Market Research
Imagine a world that’s all about you and what you want. A world that anticipates your needs and simplifies your life, without making you sacrifice privacy or security.
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News and reports
Friday, 06 November 2020 17:01
网上物联网沙龙—芯片及终端功耗篇 2020年11月18日14:00~17:00
时间：2020年11月18日 14:00~17:00
出奇长的产业链，芯片、终端、网络、平台、应用多领域，50多种物联网开发硬件，至今没有被统一的十几种物联网协议。海量物联网终端，多场景、多需求应用，搭载不同物联网技术
如NB-IoT、LoRa、ZigBee、Bluetooth、WiFi、5G、GPS，北斗，安装在不同的使用环境，使得物联网设备在研发和测试过程中面临着各种挑战。
由是德科技发起，邀请到中微半导体(深圳)股份有限公司、u-blox公司联合一起，围绕物联网低功耗MCU、蓝牙模块、低功耗测试，为大家详细剖析物联网低功耗的研发重点及应用考虑。
Thursday, 22 October 2020 09:41
2020世界智能网联汽车大会
时间：2020年11月11日-13日
地点：北京-中国国际展览中心新馆
地点：北京-中国国际展览中心新馆
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Exhibition report
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Wednesday, 14 October 2020 09:10
2020 electronic design innovation conference
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Exhibition report
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The BlueNRG-LP is an ultra-low power programmable Bluetooth® Low Energy wireless SoC solution. It embeds STMicroelectronics’s state-of-art 2.4 GHz RF radio IPs combining unparalleled performance with extremely long-battery lifetime. It is compliant with Bluetooth® Low Energy SIG core specification version 5.2 addressing point-to-point connectivity and Bluetooth Mesh networking and allows large-scale device networks to be established in a reliable way. The BlueNRG-LP is also suitable for 2.4 GHz proprietary radio wireless communication to address ultra-low latency applications.
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Bluetooth chips
The integration of Cypress is a major step for Infineon and a unique opportunity for our customers. Its product range is a perfect match. We will offer the industry’s most comprehensive portfolio for linking the real with the digital world – comprising an unparalleled range of hardware, software and security solutions for the connected age.
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News and reports
More...
Genki Instruments’ Wave uses Nordic’s nRF52832 SoC to turn hand gestures into low latency wireless instrument control
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News and reports
Wednesday, 30 September 2020 18:34
Renesas:IoT Sensor Board with Machine Learning & Bluetooth® Low Energy
Written by Blue Star
This is a reference design for a versatile Internet of Things (IoT) sensor board solution. It targets applications in industrial predictive maintenance, smart home/IoT appliances with gesture recognition, wearables (activity tracking), and mobile for innovative human machine interface, or HMI, (FingerSense) solutions. This reference design was developed with Renesas partner Qeexo, who provided their Automated Machine Learning platform (AutoML) for edge devices.
Published in
Bluetooth modules
Connectivity overview
Expanded portfolio of wireless connectivity devices across scalable memory and performance options.
Arm® Cortex® architecture
32kB to 352KB flash memory
20kB to 80kB SRAM with pin-to-pin compatibility
Across wireless connectivity protocols
Supporting a broad range of Bluetooth® Coded PHY, 2MB PHY, Extended advertising, Bluetooth Low Energy 5.1,Locationing, Mesh, Multiprotocol
Quarterly SDK releases with latest Bluetooth Low Energy features
Scalable Scalablefeatures
Integrated sensor controller, precision ADC, PA, coexistence BAW resonator
Radio
• Power output: +5dBm
• -97dBm sensitivity
• Sofware configurable
Published in
Bluetooth chips
Enhanced Security and Privacy for Bluetooth 5.0 Low Energy Connections Supported with Flexible Software Package and Comprehensive Arm Ecosystem.
Renesas Electronics Corporation introduced the first RA microcontroller (MCU) with an integrated Bluetooth® 5.0 Low Energy radio on 07 May 2020. The single-chip RA4W1 MCU includes a 48 MHz, 32-bit Arm® Cortex®-M4 core and Bluetooth 5.0 core delivered in a 56-pin QFN package. Together, the RA4W1 MCU and easy-to-use Flexible Software Package (FSP) enables engineers to immediately begin development with Arm ecosystem software and hardware building blocks that work out-of-the-box with RA MCUs.
The RA4W1 MCU makes it easy for embedded designers to develop safe and secure IoT endpoint devices for Industry 4.0, building automation, metering, healthcare, consumer wearable, and home appliance applications. The MCU is also ideal for developing IoT edge devices for wireless sensor networks, IoT hubs, an add-on to gateways, and an aggregator to IoT cloud applications.
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Bluetooth chips