Renesas Electronics Corporation introduced the first RA microcontroller (MCU) with an integrated Bluetooth® 5.0 Low Energy radio on 07 May 2020. The single-chip RA4W1 MCU includes a 48 MHz, 32-bit Arm® Cortex®-M4 core and Bluetooth 5.0 core delivered in a 56-pin QFN package. Together, the RA4W1 MCU and easy-to-use Flexible Software Package (FSP) enables engineers to immediately begin development with Arm ecosystem software and hardware building blocks that work out-of-the-box with RA MCUs.
The RA4W1 MCU makes it easy for embedded designers to develop safe and secure IoT endpoint devices for Industry 4.0, building automation, metering, healthcare, consumer wearable, and home appliance applications. The MCU is also ideal for developing IoT edge devices for wireless sensor networks, IoT hubs, an add-on to gateways, and an aggregator to IoT cloud applications.
With Microchip Bluetooth Low Energy modules, there’s no need to be an RF expert or navigate the costly and time-consuming certification process. These modules come with global certification, preprogrammed firmware and a simple ASCII interface for ease of use. Each module’s data sheet also provides board placement and layout guides to further simplify your development.
NXP wireless solutions build upon decades of Wi-Fi and Bluetooth silicon, system and software design expertise. NXP is committed to drive large-scale deployment across multiple markets by a broad array of power- and cost-optimized Wi-Fi and Bluetooth chipsets, enabling products with today’s most advanced Wi-Fi capabilities.